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Tape cleaning solution for semiconductor back-end processes "EZ Series"

A lineup of acidic and alkaline cleaning solutions! Cleaning solutions for after tape removal, such as BG and DC.

The "EZ Series" is a tape cleaning solution designed for semiconductor back-end processes that efficiently removes residues left after tape peeling. It includes an acidic "EZ-M Series" and an alkaline "EZ-A Series," both of which can be used in diluted form. It can be used as a cleaning solution after tape peeling for processes such as BG (back grinding) and DC (dicing). 【Features】 ■ Efficiently removes adhesive residues left after semiconductor tape peeling ■ Offers both acidic and alkaline cleaning solutions ■ High selectivity with electrode materials like Cu and insulating films ■ Can be diluted to high concentrations with water *For more details, please feel free to contact us.

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